深圳市托普科實業(yè)有限公司
聯系人：向經理 135-1032-9527
郵箱：market@topsmt.com
網址：www.lisec.com.cn
地址：深圳市寶安區(qū)福海街道翰宇灣區(qū)創(chuàng)新港4號樓201
Vacuum Assisted Reflow 在線式真空回流爐
Heller Industries has developed a vacuum module that inserts directly in its reflow oven line to meet rising demand of high volume, void free, automated inline soldering. This vacuum assisted reflow has been shown to reduce the voids in a solder joint by 99% and allows thermal profiles to be directly ported from non-vacuum reflow applications to
achieve low COO and high UPH.
Features 主要特點
Heller在線式真空回流爐可實現真空焊接的自動化規(guī)模量產，降低生產成本；
內置式真空模組，分五段精準抽取真空，實現無空洞焊接 (Void < 1％)；
可直接移植普通回流爐的溫度曲線，曲線方便可調。
? Applies multi-zones to suit various thermal profile requirements
多溫區(qū)設計，更多溫控點，滿足不同溫度曲線要求
? Able to achieve < 1% total void area spec
有效消除空洞，總空洞面積可控制在1%以下
? Provides optimized cycle (average 30~60s) to achieve high UPH
高效生產能力，平均生產節(jié)拍在30~60秒
? Utilizes advanced pumping package for fast pump down time
高效無油真空泵機組，可實現最短降壓時間
? Adopts high efficient flux collection system to eliminate flux condensation
高效助焊劑回收系統，預防助焊劑殘留
